Internet of Things

Two of the nine new rules stand out, given the scale of both the short-term and long-term impact that they will cause. IDTechEx assesses the impact of these changes.

In this article, IDTechEx will cover the growth drivers of advanced semiconductor packaging technologies on data center applications, as well as give several examples of cutting-edge commercial server products that adopt advanced semiconductor packaging technologies. The content of this article is from IDTechEx's newly released market research report, "Advanced semiconductor packaging 2022-2033".

Wednesday 19 October 2022 - Augmented and virtual reality devices are becoming established commercial products, but they have yet to meet their full promise of revolutionizing how we interact with computing. For this to happen, substantial hardware development needs to take place: but what are the key bottlenecks here?

On September 30th 2022, Apple CEO Tim Cook spoke to Dutch news outlet Bright about the future of augmented reality (AR) and the metaverse. On AR, Cook was bullish, stating that it "won't be that long" until we look at life without AR as we now look back to a life before the internet or smartphone.

Virtual, augmented, and mixed reality (VR/AR/MR) devices promise to revolutionize the way we interact, acting as gateways to the metaverse. Despite these technologies already achieving limited adoption, extensive headset hardware development is required to meet the demands of becoming a ubiquitous computing platform.

Powering IoT devices in a cheap, sustainable fashion is crucial to achieve the promised vision of a connected world. Small, low-cost thin film solar cells, optimized to work with diffuse indoor light, offer a solution to this dilemma.

In the shadows of a silicon-dominated field, other photovoltaic (PV) technologies have been edging closer to the spotlight.

Thursday 25 August 2022 - Analysis of advanced semiconductor packaging markets and their mid-long-term opportunity; Key applications' growth drivers; Player analysis - the dynamics of advanced semiconductor packaging battleground; Advanced semiconductor packaging technologies - current challenges and innovative trends

If the future were to be categorized in one word, it would be "data-centric". IC vendors have been pushed towards "advanced semiconductor packaging" to meet the world's data needs.

Vertical farming, the practice of growing crops indoors on vertically stacked layers, has received no small amount of interest over the last few years. The recent IDTechEx report, "Vertical Farming 2022-2032", details the economic and technological factors shaping this rapidly growing industry.